BU060Z-178-HT

Contact Finish - Mating :

Gold

Contact Finish - Post :

Copper

Contact Finish Thickness - Mating :

78.7μin (2.00μm)

Contact Finish Thickness - Post :

Flash

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polybutylene Terephthalate (PBT)，Glass Filled

Mounting Type :

Surface Mount

Number of Positions or Pins (Grid) :

6 (2 x 3)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Tube

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

BU-178HT

Termination :

Solder

Type :

DIP，0.3" (7.62mm) Row Spacing

倍数 :

1