117-43-430-41-005000

Описание :
CONN IC DIP SOCKET 30POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30μin (0.76μm)
Contact Finish Thickness - Post :
200μin (5.08μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass Alloy
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT),Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
30 (2 x 15)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Tube
Pitch - Mating :
0.070" (1.78mm)
Pitch - Post :
0.070" (1.78mm)
Series :
117
Termination :
Solder
Type :
DIP,0.4" (10.16mm) Row Spacing
倍数 :
1

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