40-516-11

Описание :
CONN IC DIP SOCKET ZIF 40POS GLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10μin (0.25μm)
Contact Finish Thickness - Post :
10μin (0.25μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyamide (PA46),Nylon 4/6,Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
40 (2 x 20)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
516
Termination :
Solder
Type :
DIP,ZIF (ZIP)
倍数 :
1

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