573400D00010G

Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.401" (10.20mm)

Length :

0.500" (12.70mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

D3Pak

Power Dissipation @ Temperature Rise :

1.0W @ 20°C

Series :

-

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

4.00°C/W @ 600 LFM

Thermal Resistance @ Natural :

14.00°C/W

Type :

Top Mount

Width :

1.220" (30.99mm)