- Series:
-
- Operating Temperature:
-
- Type:
-
- Material:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
Найдено 36 продуктов
Фото | Наименование | Производитель | Количество | Срок | Цена | КУПИТЬ | Описание | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Фото | Наименование | Производитель | Количество | Срок | Цена | КУПИТЬ | Описание | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
328
|
3 дн. |
-
|
MIN: 1 Кратность: 1
|
FINGERSTOCK BECU 7.11X406.4MM
|
- | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
102
|
3 дн. |
-
|
MIN: 1 Кратность: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.055" (1.40mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP COIL BF
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,NID,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,ZNY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.055" (1.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP,STR,SU,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
0.11 X 0.28 BD 16--11-28RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
0.11 X 0.28 BD 16--11-S-28RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
0.11 X 0.28 X 0.23 NI 16--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | Flash | Adhesive |