- Applications:
-
- Operating Temperature:
-
- Package / Case:
-
- Size / Dimension:
-
- ESR (Equivalent Series Resistance):
-
Найдено 3 продуктов
Фото | Наименование | Производитель | Количество | Срок | Цена | КУПИТЬ | Описание | Series | Applications | Operating Temperature | Package / Case | Features | Size / Dimension | Height | ESR (Equivalent Series Resistance) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Фото | Наименование | Производитель | Количество | Срок | Цена | КУПИТЬ | Описание | Series | Applications | Operating Temperature | Package / Case | Features | Size / Dimension | Height | ESR (Equivalent Series Resistance) | ||
IPDiA |
826
|
3 дн. |
-
|
MIN: 1 Кратность: 1
|
CAP SILICON 3.3UF 15% 11V 1812
|
XTSC | High Temperature | -55°C ~ 250°C | 1812 (4532 Metric) | High Reliability | 0.183" L x 0.140" W (4.66mm x 3.56mm) | 0.016" (0.41mm) | 400 mOhms | ||||
IPDiA |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
CAP SILICON 3.3UF 15% 11V 1616
|
ETSC | Wirebond and Embedded | -55°C ~ 200°C | 1616 (4040 Metric) | High Reliability,Low Profile | 0.157" L x 0.157" W (4.00mm x 4.00mm) | 0.010" (0.25mm) | 100 mOhms | ||||
IPDiA |
По запросу
|
- |
-
|
MIN: 1 Кратность: 1
|
CAP SILICON 3.3UF 15% 11V 1812
|
HTSC | High Temperature | -55°C ~ 200°C | 1812 (4532 Metric) | High Reliability | 0.183" L x 0.140" W (4.66mm x 3.56mm) | 0.016" (0.41mm) | 400 mOhms |